Insulectro offers a full line of DuPont™ metallization processes.
Insulectro offers a full line of DuPont™ metallization processes. For acid copper plating applications, there are multiple options depending on the application. A full range of DC plating systems, pulse plating, and via fill technologies are all available.
DC Copper Plating
High aspect ratio, high throwing power DC panel or pattern plating process with excellent leveling and thickness distribution. Current denisty range of 5-20 ASF.
High throughput, fine grained DC pattern or panel plating process. Designed for plating applications with 10-30 ASF requirements where throughput and ease of control is desired.
Mid to high current density copper plating system, with capabilities up to 40 ASF. Capable for panel or pattern plating applications.
Excellent throwing power, surface distribution and leveling for low current density applications (<15 ASF).
Provides enhanced via-filling performance while simultaneously through-hole plating at low surface thickness.
Thick panel, high aspect ratio applications utilizing PPR waveforms. Excellent performance with blind vias.